flip-chip
常見例句
- Flip Chip technology is a typical application.
倒裝芯片技術就是其中一個典型應用。 - As an electric current passes through, the Joule heating and electromigration effects occur in the flip chip solder bumps.
當電流通過焊點時,會伴隨產生焦耳熱效應和電遷移效應。 - A summary of developmental work done in the field of single pass high reliability Flip Chip Reflow Encapsulants.
關于單遍高可靠性倒裝片回流密封劑領域研發(fā)工作成就的綜述。 - The current crowding effect and temperature distributions in flip chip solders are discussed.
本研究亦討論在覆晶焊點中之電流聚集效應及其溫度分布。 - Delamination at the underfill/chip interface in a flip chip on board (FCOB) assembly was investigated through MSC.
采用通用有限元軟件MSC. - Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit Flip Chip packages.
完成某集成電路封裝(叩焊芯片)內部實際的電氣連接的焊料中的鉛。 返回 flip-chip